Аннотация:Sputtering of Ni5Pd and NiPd5 alloys by 0.5-50keV Ar ions has been studied by means of binary-collision simulation. Special attention was given to the angular distributions of sputtered atoms at the steady-state conditions and to the relevant concentrations of Ni and Pd surface atoms, SNi and SPd, respectively. The simulation results were compared with the experimental data published recently. The best-fit values of SNi and SPd favor segregation of Pd in Ni5Pd and segregation of Ni in NiPd5. For a Ni5Pd alloy, it is expected that the ratio SNi/SPd will increase with energy, at least up to 10-20keV.