|
ИСТИНА |
Войти в систему Регистрация |
ИПМех РАН |
||
Galvanic replacement reaction between an Fe substrate and Cu(I) and Cu(II) ions in a deep eutectic solventстатья
Статья опубликована в высокорейтинговом журнале
Информация о цитировании статьи получена из
Scopus
Статья опубликована в журнале из списка Web of Science и/или Scopus
Дата последнего поиска статьи во внешних источниках: 19 июня 2024 г.
- Авторы: Filippov Vadim L., Shapagin Alexey V., Rudnev Alexander V.
- Журнал: Journal of Electroanalytical Chemistry
- Том: 965
- Год издания: 2024
- Издательство: Elsevier Sequoia
- Местоположение издательства: Switzerland
- Номер статьи: 118372
- DOI: 10.1016/j.jelechem.2024.118372
- Аннотация: The galvanic replacement (GR) reaction between Fe and Cu in aqueous electroplating solutions typically leads to unsatisfactory adhesion of a Cu coating to the substrates. Here, we study the GR process in one of the most promising deep eutectic solvents for electrodeposition – ethaline. We find out that GR deposition of Cu does occur on Fe in ethaline, but it proceeds with a much lower rate as compared to aqueous copper sulphate electrolyte solutions, and forming Cu deposits display rather strong adhesion to Fe substrates. The rate of Cu deposition via the GR reaction is estimated by means of inductively coupled plasma mass spectrometry, whereas the morphology of the sample surface is analyzed using atomic force and scanning electron microscopy. We reveal significant difference in the rate of Cu deposit growth, the character of Fe substrate corrosion, and Cu deposit morphology in the course of GR process in ethaline solutions containing CuCl and CuCl2. In the Cu(I) solution, the GR is characterized by the appearance of pronounced pits on the Fe surface and the nucleation and growth of separate copper crystallites that reach a few micrometers in diameter after 24 h of the reaction. In the case of the Cu(II) solution, relatively uniform copper coatings are formed even after 30 min of the reaction, which leads to deceleration of the GR due to the blocking of the Fe surface undergoing dissolution. Overall, due to the rather low GR reaction rate its effect on the electrochemical deposition of Cu on Fe is negligible. The obtained results allow us to conclude that ethaline-based solutions are promising media for direct copper electrodeposition technology on electronegative metals and alloys.
- Добавил в систему: Филиппов Вадим Леонидович