Technological Process of Assembly and QA Testing of Silicone Tracking Modules with Silicon Strip Sensor

Авторы: Sheremetev A.D., Leontiev V.V., Dementev D.V., Shitenkov M.O., Murin Yu A.
Журнал: Physics of Particles and Nuclei Letters
Том: 21
Номер: 3
Год издания: 2024
Издательство: Pleiades Publishing, Ltd
Местоположение издательства: Road Town, United Kingdom
Первая страница: 466
Последняя страница: 480
DOI: 10.1134/S1547477124700456
Аннотация: The key technological stages of assembly of silicone tracking modules with silicon strip sensors for use in the wide-aperture silicon tracking system of the BM@N experiment are considered. Methods for finding the optimal parameters for the ultrasonic linear automatic welding of aluminum microcables with a silicon sensor are described. The methodology and results of intermediate QA testing during the assembly of the silicone tracking module are presented. The method of mounting unpackaged microcircuits on a board is described. The results of the preproduction assembly of silicone tracking modules are presented.
Добавил в систему: Леонтьев Владимир Викторович

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