Materials for advanced metallisation International workshop, Dresden, Germany, March 26-29, 2017сборник
Статьи, опубликованные в сборнике
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2017
Deep Silicon etching in cryo process for TSV 3D integration
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Miakonkikh A.V.,
Rogozhin A.E.,
Tatarintsev A.A.,
Gushin O.P.,
Rudenko K.V.,
Lukichev V.F.
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в сборнике Materials for advanced metallisation International workshop, Dresden, Germany, March 26-29, 2017, тезисы